Hi swihi swipfuno swa bisphenol A epoxy resin?
Bisphenol ya A bpa epoxy resin i muxaka wa epoxy resin lowu humelerisiwaka ngopfu naswona wu tirhisiwaka ngopfu. Yikombisa ku vonakala lokukulu naswona yi endliwa kusuka eka bisphenol A BPA na epichlorohydrin eka vukona bya sodium hydroxide. Digiri ya polymerization, leyi kombisiwaka tani hi "n", hi ntolovelo yisuka eka 0 kuya eka 25.Hi ku ya hi ntiko wa molecular, ti epoxy resins tinga hlayiwa hi ti grade to hambana hambana. Hiku angarhela, ti molecular weight epoxy resins tale hansi tina nhlayo yale xikarhi ya "n" yale hansi ka 2 xikan’we na softening point yale hansi ka 50°C, naswona tivuriwa ti soft epoxy resins. Ti resins ta molecular weight yale xikarhi tina "n" value exikarhi ka 2 na 5, laha kungana softening point kusuka eka 50°C kuya eka 95°C. Ti resins letingana "n" value leyikulu kutlula 5 (softening point yale henhla ka 100°C) ti hlayiwa tani hi ti resins ta molecular weight yale henhla.






